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product structure silicon monolithic integrated circuit this product has no designed protection against radioactive rays 1/ 18 tsz02201 - 0313aaf00360 - 1 - 2 ? 20 1 6 rohm co., ltd. all rights reserved. 19.feb.2016 rev.001 tsz22111 ? 14 ? 001 www.rohm.com power supply ic series for tft-lcd panels gamma voltage generated ic with built - in dac bd81 010 muv general description the feature of gamma voltage generat ed ic BD81010MUV provide s a single - chip solution with a high - precision 10 - bit dac setting con trolled by i 2 c serial communications interface , a buffer amp (14ch), and a operational amplifier for hvdd (1ch). features ? single - chip design means fewer c omponents ? built in 10bit dac (14ch) ? built in dac output buffer a mplifier (14ch) ? built in o per ation a mplifier (1ch) for hvdd ? i 2 c i nterface ( sda, scl ) ? thermal shutdown c ircuit ? under - voltage lockout protection c ircuit ? power on reset c ircuit ? input t olerant ( sda, scl, en ) applications it may be used with tft - lcd panels, such as big scre en and high resolution lcd televisions. key specifications ? power supply voltage range (vdd) : 2.1 v to 3.6v ? power supply voltage range(v cc ): 8.0v to 18.0v ? operating temperature range : -4 0 c to + 8 5 c package w (typ) x d(typ) x h(max) vqfn032v5050 5.00mm x 5.00mm x 1.00mm datashee t datashee t
2 / 18 tsz02201 - 0313aaf00360 - 1 - 2 ? 20 1 6 rohm co., ltd. all rights re served. 19.feb.2016 rev.001 www.rohm.com tsz22111 15 001 bd81 010 muv block diagram 1 2 3 4 5 6 7 8 2 4 2 3 2 2 2 1 2 0 1 9 1 8 1 7 2 5 1 6 d g n d g n d v c c g n d v d d e n s c l s d a d a c g n d f b r e f i n v d a c v c c s e r i a l i / f v c c d a c g n d p o w e r o n r e s e t v r e f u v l o ( v c c , r e f i n , v d d ) t s d v d d i n p i n n h v d d 3 2 d a c 3 o u t 7 r e f i n v c c 3 1 d a c 3 o u t 8 r e f i n v c c 3 0 d a c 3 o u t 9 r e f i n v c c 2 9 d a c 3 o u t 1 0 r e f i n v c c 2 8 d a c 3 o u t 1 1 r e f i n v c c 2 7 d a c 3 o u t 1 2 r e f i n v c c 2 6 d a c 3 o u t 1 3 r e f i n v c c 9 d a c 3 o u t 6 r e f i n v c c 1 0 d a c 3 o u t 5 r e f i n v c c 1 1 d a c 3 o u t 4 r e f i n v c c 1 2 d a c 3 o u t 3 r e f i n v c c 1 3 d a c 3 o u t 2 r e f i n v c c 1 4 d a c 3 o u t 1 r e f i n v c c 1 5 d a c 3 o u t 0 r e f i n v c c v d d v c c o p - a m p v d d
3 / 18 tsz02201 - 0313aaf00360 - 1 - 2 ? 20 1 6 rohm co., ltd. all rights re served. 19.feb.2016 rev.001 www.rohm.com tsz22111 15 001 bd81 010 muv p in configuration pin descriptio n pin no. pin name function pin no. pin name function 1 en vdac enable pin 17 vcc power supply input 2 dgnd log ic , protection circuit gnd input 18 dacgnd gnd input for dac 3 vdd logic power supply input 19 vdd logic power supply input 4 sda serial data input pin 20 fb feedback pin 5 scl serial clock input pin 21 refin dac reference voltage input pin 6 inp ampl ifier + input pin 22 vdac dac voltage output 7 inn amplifier C 1 2 3 4 6 8 7 5 9 10 11 12 13 14 15 16 24 23 22 21 19 17 18 20 32 31 30 29 28 27 26 25
4 / 18 tsz02201 - 0313aaf00360 - 1 - 2 ? 20 1 6 rohm co., ltd. all rights re served. 19.feb.2016 rev.001 www.rohm.com tsz22111 15 001 bd81 010 muv absolut e maximum ratings (ta=25 c ) parameter symbol rating unit power supply voltage 1 v dd 4.5 v power supply voltage 2 v cc 19.0 v refin v oltage v refin 7.0 v dac referenc e v oltage v dac 7.0 v op. amplifier input pin v oltage v inp , v inn 15.0 v functional pin v oltage v en 4.5 v 2 lines s erial terminal voltage v sda , v scl 4.5 v junction temperature tjmax 150 c power dissipation pd 4 . 56 (note 1) w operating temperature range topr - 40 to +85 c storage temperature range tstg - 55 to +150 c (note 1 ) to use the ic at temperatures over ta ? ?
5 / 18 tsz02201 - 0313aaf00360 - 1 - 2 ? 20 1 6 rohm co., ltd. all rights re served. 19.feb.2016 rev.001 www.rohm.com tsz22111 15 001 bd81 010 muv electrical characteristics (unless otherwise noted, ta ?
6 / 18 tsz02201 - 0313aaf00360 - 1 - 2 ? 20 1 6 rohm co., ltd. all rights re served. 19.feb.2016 rev.001 www.rohm.com tsz22111 15 001 bd81 010 muv electrical characte ristics C ?
7 / 18 tsz02201 - 0313aaf00360 - 1 - 2 ? 20 1 6 rohm co., ltd. all rights re served. 19.feb.2016 rev.001 www.rohm.com tsz22111 15 001 bd81 010 muv operation of each block (1) regulator (vdac) this is a regulator block for setting a reference voltage of dac. vdac has enable function so that if en=low, shut down is performed, or en=high, settable vdac voltage by fb voltage and external resistor. at this t ime, vdac voltage < 5.5[v] (max ope rating voltage) should be configured. vdac output capacity (c11) is set over 1[ f]. phase compensation (c12) is able to use as open, but it is recommended to set the pcb pattern. figure 1. regulator block ex ample) in case r11=18[k], r12=2 [k], vdac equals to 5.0[v]. 0[k] 100[k] is a recommended range for the sum of setting value of r11,r12. if the setting is below 10[k], . if the setting exceeds 100[k], offset ] [ 12 12 11 50 . 0 v r r r vdac ? ? ? e n f b r e f i n v d a c v r e f v d d v c c r 1 1 r 1 2 c 1 1 c 1 2
8 / 18 tsz02201 - 0313aaf00360 - 1 - 2 ? 20 1 6 rohm co., ltd. all rights re served. 19.feb.2016 rev.001 www.rohm.com tsz22111 15 001 bd81 010 muv (2 ) 10 bit dac block serial data control block the serial interface uses a 2 - line serial data format (scl, sda). the serial data control block consists of a register that stores data from the sda and scl pins , and a dac circuit that receives the output from this register and provides adjusted voltages to other ic blocks. figure 2. serial block diagram register ( ch0 to ch13 ) a serial signal (consisting of 10 - bit gamma correction voltage values) input using the serial interface or i 2 c bus interface is held for each register address. data is initialized by the reset signal generated during a power - on reset. dac the dac logic con verts the 10 - bit digital signal read to the register to a voltage. amp ( ch0 to ch13 ) the a mp amplifies the voltage output from the dac logic by 3 times. while under voltage lock - out (uvlo) circuit or thermal shut down (tsd) circuit is operating, outpu t goes into hi - z. in case connecting high capacity capacitor with low esr, damping is needed with a resistor to keep phase margin. s h i f t r e g i s t e r d a c 3 o u t 0 r e g i s t e r 0 d a c 3 o u t 1 r e g i s t e r 1 d a c 3 o u t 2 r e g i s t e r 2 d a c 3 o u t 3 r e g i s t e r 3 d a c 3 o u t 4 r e g i s t e r 4 d a c 3 o u t 5 r e g i s t e r 5 d a c 3 o u t 6 r e g i s t e r 6 d a c 3 o u t 7 r e g i s t e r 7 d a c 3 o u t 8 r e g i s t e r 8 d a c 3 o u t 9 r e g i s t e r 9 d a c 3 o u t 1 0 r e g i s t e r 1 0 d a c 3 o u t 1 1 r e g i s t e r 1 1 d a c 3 o u t 1 2 r e g i s t e r 1 2 d a c 3 o u t 1 3 r e g i s t e r 1 3 a c k n o w l e d g e s d a s c l
9 / 18 tsz02201 - 0313aaf00360 - 1 - 2 ? 20 1 6 rohm co., ltd. all rights re served. 19.feb.2016 rev.001 www.rohm.com tsz22111 15 001 bd81 010 muv output voltage setting mode writes to a register address specified by i 2 c bus . mode for writing from i 2 c bus to register are ( i )single mode and ( ii )multi mode. on single mode, write data to one designated register. on multi mode, multi data write can be performed continuously from a start address register specified with the second byte of data. single mode or multi mode can be configured by having or not having s c l s d a _ i n d e v i c e _ o u t w r i t e s i n g l e d a c r e g i s t e r . r 3 - r 0 s p e c i f y d a c a d d r e s s . s t a r t d e v i c e a d d r e s s w r i t e a c k n s t a r t d a c a d d r e s s p o i n t e r . r 6 - r 4 h a v e n o m e a n i n g a c k n a 6 a 5 a 4 a 3 a 2 a 1 a 0 r / w a c k n w s r 6 r 5 r 4 r 3 r 2 r 1 r 0 a c k n d 1 5 d 1 4 d 1 3 d 1 2 d 1 1 d 1 0 d 9 d 8 a c k n d 7 d 6 d 5 d 4 d 3 d 2 d 1 d 0 a c k n d a c ( p o i n t e r ) m s b y t e . d 1 5 - d 1 0 h a v e n o m e a n i n g a c k n d a c ( p o i n t e r ) l s b y t e . a c k n s t o p a 6 a 5 a 4 a 3 a 2 a 1 a 0 r / w a c k n w s r 6 r 5 r 4 r 3 r 2 r 1 r 0 a c k n d 1 5 d 1 4 d 1 3 d 1 2 d 1 1 d 1 0 d 9 d 8 a c k n d 7 d 6 d 5 d 4 d 3 d 2 d 1 d 0 a c k n t h e w h o l e d a c r e g i s t e r d 9 - d 0 i s u p d a t e i n t h i s m o m e n t . s c l s d a _ i n d e v i c e _ o u t w r i t e m u l t i p l e d a c r e g i s t e r s . r 3 - r 0 s p e c i f y s t a r t d a c a d d r e s s s t a r t d e v i c e a d d r e s s w r i t e a c k n s t a r t d a c a d d r e s s p o i n t e r . r 6 - r 4 h a v e n o m e a n i n g a c k n a 6 a 5 a 4 a 3 a 2 a 1 a 0 r / w a c k n w s r 6 r 5 r 4 r 3 r 2 r 1 r 0 a c k n d 1 5 d 1 4 d 1 3 d 1 2 d 1 1 d 1 0 d 9 d 8 a c k n d 7 d 6 d 5 d 4 d 3 d 2 d 1 d 0 a c k n d a c ( p o i n t e r ) m s b y t e . d 1 5 - d 1 0 h a v e n o m e a n i n g a c k n d a c ( p o i n t e r ) l s b y t e . a c k n a 6 a 5 a 4 a 3 a 2 a 1 a 0 r / w a c k n w s r 6 r 5 r 4 r 3 r 2 r 1 r 0 a c k n d 1 5 d 1 4 d 1 3 d 1 2 d 1 1 d 1 0 d 9 d 8 a c k n d 7 d 6 d 5 d 4 d 3 d 2 d 1 d 0 a c k n ? ? ? ? ? ? ? ? ? d 1 5 d 1 4 d 1 3 d 1 2 d 1 1 d 1 0 d 9 d 8 a c k n d 7 d 6 d 5 d 4 d 3 d 2 d 1 d 0 a c k n d a c ( 3 ) m s b y t e . d 1 5 - d 1 0 h a v e n o m e a n i n g a c k n d a c ( 3 ) l s b y t e . a c k n d 1 5 d 1 4 d 1 3 d 1 2 d 1 1 d 1 0 d 9 d 8 a c k n d 7 d 6 d 5 d 4 d 3 d 2 d 1 d 0 a c k n s t o p ? ? ? ? ? ? ? ? ? t h e w h o l e d a c r e g i s t e r d 9 - d 0 i s u p d a t e i n t h i s m o m e n t . t h e w h o l e d a c r e g i s t e r d 9 - d 0 i s u p d a t e i n t h i s m o m e n t .
10 / 18 tsz02201 - 0313aaf00360 - 1 - 2 ? 20 1 6 rohm co., ltd. all rights re served. 19.feb.2016 rev.001 www.rohm.com tsz22111 15 001 bd81 010 muv comman d in terface use i 2 c bus for command interface with host. writing or reading by specifying 1 byte select address, along with slave address. i 2 c bus slave mode format is shown below. msb lsb msb lsb msb lsb s slave address a select address a data a p s : start condition slave address : after slave mode(7bit), with read mode (h) or light mode (l), send 8 bit data in all. ( msb first) >' a : acknowledge added acknowledge bit per byte in sending and receiving data. if the data is sent/ received properly, f l g is send/ received. sending/ receiving h s slave ad dress a select address a register1 data0 a register1 data1 a p ( ex. ) ech 01h 03h fch the case where writing 3fch from dac0 to dac3 ( multi mode ) s slave address a select address a register0 data0 a re gister0 data1 a register1 data0 a register1 to 3 data0,data1 a p ( ex. ) ech 00h 03h fch 03h dac register address diagram data0 >8 upper 8 bits, data1 >8 lower 8 bit, x >8 dont care, d9 r3 r2 r1 r0 7 6 5 4 3 2 1 0 data0 x x x x x x d9 d8 data1 d7 d6 d5 d4 d3 d2 d1 d0 data0 x x x x x x d9 d8 data1 d7 d6 d5 d4 d3 d2 d1 d0 data0 x x x x x x d9 d8 data1 d7 d6 d5 d4 d3 d2 d1 d0 data0 x x x x x x d9 d8 data1 d7 d6 d5 d4 d3 d2 d1 d0 data0 x x x x x x d9 d8 data1 d7 d6 d5 d4 d3 d2 d1 d0 data0 x x x x x x d9 d8 data1 d7 d6 d5 d4 d3 d2 d1 d0 data0 x x x x x x d9 d8 data1 d7 d6 d5 d4 d3 d2 d1 d0 data0 x x x x x x d9 d8 data1 d7 d6 d5 d4 d3 d2 d1 d0 data0 x x x x x x d9 d8 data1 d7 d6 d5 d4 d3 d2 d1 d0 data0 x x x x x x d9 d8 data1 d7 d6 d5 d4 d3 d2 d1 d0 data0 x x x x x x d9 d8 data1 d7 d6 d5 d4 d3 d2 d1 d0 data0 x x x x x x d9 d8 data1 d7 d6 d5 d4 d3 d2 d1 d0 data0 x x x x x x d9 d8 data1 d7 d6 d5 d4 d3 d2 d1 d0 data0 x x x x x x d9 d8 data1 d7 d6 d5 d4 d3 d2 d1 d0 0221h 0265h 02aah 02eeh 0043h 0088h 00cch 0110h output pin 0 0 register 0 out0 register name bit initial value 03bbh out1 0 0 register 2 out2 0 1 register 1 0332h 0376h out3 1 0 register 4 out4 0 1 0 register 3 out5 1 0 register 6 out6 1 1 0 1 register 5 out7 0 0 register 8 out8 1 1 register 7 0199h 01ddh register 10 out10 1 register 9 out9 0 0154h 0 1 0 1 0 0 register 12 out12 1 0 0 out13 1 1 register 13 0 out11 1 0 register 11 1 0 0 1 1 0 0 0 0 0 1 1 register address 1 1 1 1 0 0 0
11 / 18 tsz02201 - 0313aaf00360 - 1 - 2 ? 20 1 6 rohm co., ltd. all rights re served. 19.feb.2016 rev.001 www.rohm.com tsz22111 15 001 bd81 010 muv ? figure 5. timing ? sclh scll ? the relation between buffer output voltage (out0 to out13) and dac setting value is shown below. buffer output terminals out0 to out13 output after uvlo release of vcc. while uvlo detection, th e output is h iz. refin value setting dac out to out voltage output ? ? ? ? 3 1024 1 ) 13 0 ( t b u f t h d : s t a t s u ; d a t t r t l o w t h i g h t h d ; d a t t d h t p d t f s c l s d a ( i n ) s d a ( o u t ) t s u ; s t a t h d ; s t a t l t s u ; s t o s c l s d a s p s s t a r t b i t p s t o p b i t
12 / 18 tsz02201 - 0313aaf00360 - 1 - 2 ? 20 1 6 rohm co., ltd. all rights re served. 19.feb.2016 rev.001 www.rohm.com tsz22111 15 001 bd81 010 muv (3) o peration amplifier for hvdd if output current ability over 20ma is needed for dac output, shown below. only using an amplifier, voltage is able to set by resistor, shown below fig ure 7 . for the reference side, use the regulator output type of power supply. it is recommended to set the rcom1,rcom2 in the range of 1 0k to 100k 10k may increase current consumption, thus resulting in degraded power efficiency. setting them to not less than 100k may r in case connecting hvdd with low esr capacitor, damping is needed with a resistor (r32) to keep phase margin. use the buffer type if hvdd is not used, and ground the inp pin. fig ure 6. use as output for dac fig ure 7. use amplifier only b y having resistor divider (4) power on reset when the digital power supply vdd is activated, each ic generates a reset digital to initialize the serial i/f and each registers. (5) uvlo(under voltage lock out) turns output off when the voltage of digita l power supply vdd, amplifier power supply vcc and dac reference voltage refin goes below the limit value. (6) tsd(thermal shut down) the tsd circuit turns output off when the chip temperature reaches or exceeds approximately 175 c in order to prevent t hermal destruction or thermal runaway. when the chip returns to a specified temperature, the circuit resets. the tsd circuit is designed only to protect the ic itself. application thermal design should ensure operation of the ic below the junction tempera ture of approximately 150 c . i n p i n n h v d d r e f e r e n c e v o l t a g e r c o m 1 r c o m 2 r 3 2 c 3 2 i n p i n n h v d d o u t 5 r 3 1 ( f o r t h e r m a l s h u t d o w n ) c 3 1
13 / 18 tsz02201 - 0313aaf00360 - 1 - 2 ? 20 1 6 rohm co., ltd. all rights re served. 19.feb.2016 rev.001 www.rohm.com tsz22111 15 001 bd81 010 muv sequence image 1. en=high before vcc power supply turns on fig ure 8. sequence image 1 2. en=high after vcc power supply turns on fig ure 9. sequence image 2 out0 to out13 out0 to out13 v d d ( 3 . 3 v ) v c c ( 1 5 . 6 v ) d a c c o n t r o l ( d a c o u t p u t o u t 0 1 3 v d a c = r e f i n e n h v d d ( i n c a s e u s i n g i n p a s v c c r e s i s t o r d i v i d e r v c c ( 1 5 . 6 v ) v d d ( 3 . 3 v ) v c c ( 1 5 . 6 v ) d a c c o n t r o l ( d a c o u t p u t o u t 0 1 3 v d a c = r e f i n e n i f e n b e c o m e s h i g h s i m u l t a n e o u s l y w i t h v d d , s i m i l a r s e q u e n c e c o m e s o u t . h v d d ( i n c a s e u s i n g i n p a s v c c r e s i s t o r d i v i d e r v c c ( 1 5 . 6 v )
14 / 18 tsz02201 - 0313aaf00360 - 1 - 2 ? 20 1 6 rohm co., ltd. all rights re served. 19.feb.2016 rev.001 www.rohm.com tsz22111 15 001 bd81 010 muv operatio n al notes 1. reverse c onnection of p ower s upply connecting the power supply in reverse polarity can damage the ic. take pr ecautions against reverse polarity when connecting the power supply , such as mounting an external diode between the power supply and the ic subject the ic to stress. always discharge capacitors completely after each process or step. the ics power supply
15 / 18 tsz02201 - 0313aaf00360 - 1 - 2 ? 20 1 6 rohm co., ltd. all rights re served. 19.feb.2016 rev.001 www.rohm.com tsz22111 15 001 bd81 010 muv operational notes C be within the ics power dissipation rating. if however the rating is exceeded for a continued period, the junc n n p + p n n p + p s u b s t r a t e g n d n p + n n p + n p p s u b s t r a t e g n d g n d p a r a s i t i c e l e m e n t s p i n a p i n a p i n b p i n b b c e p a r a s i t i c e l e m e n t s g n d p a r a s i t i c e l e m e n t s c b e t r a n s i s t o r ( n p n ) r e s i s t o r n r e g i o n c l o s e - b y p a r a s i t i c e l e m e n t s
16 / 18 tsz02201 - 0313aaf00360 - 1 - 2 ? 20 1 6 rohm co., ltd. all rights re served. 19.feb.2016 rev.001 www.rohm.com tsz22111 15 001 bd81 010 muv ordering information b d 8 1 0 1 0 m u v - e 2 part number package muv: vqfn032v5050 packaging and forming specification e2: embossed tape and reel marking diagram vqfn032v5050 (top view) 81010 part number marking lot number 1pin mark b d
17 / 18 tsz02201 - 0313aaf00360 - 1 - 2 ? 20 1 6 rohm co., ltd. all rights re served. 19.feb.2016 rev.001 www.rohm.com tsz22111 15 001 bd81 010 muv physical dimension , tape and reel information package name vqfn032v5050
18 / 18 tsz02201 - 0313aaf00360 - 1 - 2 ? 20 1 6 rohm co., ltd. all rights re served. 19.feb.2016 rev.001 www.rohm.com tsz22111 15 001 bd81 010 muv revision history date revision changes 19 .feb .2016 001 new release
notice - p ga - e rev.00 3 ? 201 5 rohm co., ltd. all rights reserved. notice precaution on using rohm products 1. our p roducts are designed and manufactured for application in ordinary electronic equipment s ( such as av equipment, oa equipment, telecommunication equipment, home elec tronic appliances, amusement equipment, etc.). if you intend to use our products in devices requiring extremely high reliability ( such as medical equipment ( n ote 1 ) , transport equipment, traffic equipment, aircraft/spacecraft, nuclear power controllers, f uel controllers, car equipment including car accessories, safety devices, etc.) and whose malfunction or failure may cause loss of human life , bodily injury or serious damage to property ( specific applications ) , please consult with the rohm sales represe ntative in advance. unless otherwise agreed in writing by rohm in advance, rohm shall not be in any way responsible or liable for any damages, expenses or losses incurred by you or third parties arising from the use of any rohm s products for specific appl ications. ( n ote1) m edical e quipment c lassification of the s pecific applications japan usa eu china class 2. rohm designs and manufactures its products subject to strict quality control system. however, semiconductor products can fail or malfunction at a certain rate. please be sure to implement, at your own responsi bilities, adequate safety measures including but not limited to fail - safe design against the physical injury, damage to any property, which a failure or malfunction of our products may cause. the following are examples of safety measures: [a] installation of protection circuits or other protective devices to improve system safety [b] installation of redundant circuits to reduce the impact of single or multiple circuit failure 3. our p roducts are designed and manufactured for use under standard conditions a nd not under any special or extraordinary environments or conditions, as exemplified below . accordingly, rohm shall not be in any way responsible or liable for any damages, expenses or losses arising from the use of any rohms p roduct s under any special or extraordinary environments or conditions . if you intend to use our products under any special or extraordinary environments or conditions (as exemplified below), your independent v erification and confirmation of product performance, reliability, etc, pri or to use, must be necessary : [a] use of our products in any types of liquid, including water, oils, chemicals, and organic solvents [b] use of our products outdoors or in places where the p roducts are exposed to direct sunlight or dust [c] use of our prod ucts in places where the p roducts are exposed to sea wind or corrosive gases, including cl 2 , h 2 s, nh 3 , so 2 , and no 2 [d] use of our products in places where the p roducts are exposed to static electricity or electromagnetic waves [e] use of our products in p roximity to heat - producing components, plastic cords, or other flammable items [f] s ealing or coating our p roducts with resin or other coating materials [g] use of our products without cleaning residue of flux (even if you use no - clean type fluxes, cleanin g residue of flux is recommended); or washing our products by using water or water - soluble cleaning agents for cleaning residue after soldering [h] use of the p roducts in places subject to dew condensation 4 . the p roducts are not subject to radiation - proo f design . 5 . please verify and confirm characteristics of the final or mounted products in using the products. 6 . in particular, if a transient load (a large amount of load applied in a short period of time, such as pulse. is applied, confirmation of pe rformance characteristics after on - board mounting is strongly recommended. avoid applying power exceeding normal rated power; exceeding the power rating under steady - state loading condition may negatively affect product performance and reliability. 7 . de - rate power dissipation d epending on a mbient temperature . when used in sealed area, confirm that it is the use in the range that does not exceed the maximum junction temperature. 8 . confirm that operation temperature is within the specified range described in the product specification. 9 . rohm shall not be in any way responsible or liable for f ailure induced under devian t condition from what is defined in this document . precaution for mounting / circuit board design 1. when a highly active halogenous (chlorine, bromine, etc.) flux is used, the residue of flux may negatively affect product performance and reliability. 2. in principle, the reflow soldering method must be used on a surface - mount products, the flow soldering method must be used on a through hole mount products. i f the flow soldering method is preferred on a surface - mount products , please consult with the roh m representative in advance. for details , please refer to rohm mounting specification
notice - p ga - e rev.00 3 ? 201 5 rohm co., ltd. all rights reserved. precautions regarding application examples and external circuits 1. if change is made to the constant of an external circuit, please allow a sufficient margin considerin g variations of the characteristics of the p roducts and external components, including transient characteristics, as well as static characteristics. 2. you agree that application notes, reference designs, and associated data and information contained in t his document are presented only as guidance for products use . therefore, in case you use such information, you are solely responsible for it and you must exercise your own independent verification and judgment in the use of such information contained in t his document. rohm shall not be in any way responsible or liable for any damages, expenses or losses incurred by you or third parties arising from the use of such information. precaution for electrostatic this p roduct is e lectrostatic sensitive product, which may be damaged due to e lectrostatic discharge. please take proper caution in your manufacturing process and stor age so that voltage exceeding the product s maximum rating will not be applied to p roducts. please take special care under dry condition (e .g. grounding of human body / equipment / solder iron, isolation from charged objects, setting of ionizer, friction prevention and temperature / humidity control). precaution for storage / transportation 1. product performance and soldered connections may deteriorate if the p roducts are stored in the places where : [a] the p roducts are exposed to sea winds or corrosive gases, including cl2, h2s, nh3, so2, and no2 [b] the temperature or humidity exceeds those recommended by rohm [c] the products are exposed to direct sunshine or condensation [d] the products are exposed to high electrostatic 2. even under rohm recommended storage condition, solderability of products out of recommended storage time period may be degraded. it is strongly recommended to confirm solderability before using p roducts of which storage time is exceeding the recommended storage time period. 3. store / transport cartons in the correct direction, which is indicated on a carton with a symbol. otherwise bent leads may occur due to excess ive stress applied when dropping of a carton. 4. use p roducts within the specified time after opening a humidity barrier bag. baking is required before using p roducts of which storage time is exceeding the recommended storage time period . precaution for p roduct l abel a two - dimensional barcode printed on rohm p roduct s label is for rohm s internal use only . precaution for d isposition when disposing p roducts please dispose them properly using a n authorized industry waste company. precaution for foreign e xchange and foreign t rade act since concerned goods might be fallen under listed items of export control prescribed by foreign exchange and foreign trade act, please consult with rohm in case of export. precaution regarding intellectual property rights 1. all information an d data including but not limited to application example contained in this document is for reference only. rohm does not warrant that foregoing information or data will not infringe any intellectual property rights or any other rights of any third party reg arding such information or data. 2. rohm shall not have any obligations where the claims, actions or demands arising from the combination of the products with other articles such as components, circuits, systems or external equipment (including software). 3. no license, expressly or implied, is granted hereby under any intellectual property rights or other rights of rohm or any third parties with respect to the products or the information contained in this document. provided, however, that rohm will not assert it s intellectual property rights or other rights against you or your customers to the extent necessary to manufacture or sell products containing the products, subject to the terms and conditions herein. other precaution 1. this document may not be reprinted or reproduced, in whole or in part, without prior written consent of rohm. 2. the products may not be disassemble d, converted, modified, reproduced or otherwise changed without prior written consent of rohm. 3. i n no event shall you use in any way whatso ever the products and the related technical information contained in the products or this document for any military purposes , including but not limited to, the development of mass - destruction weapons . 4. the proper names of companies or products described in this document are trademarks or registered trademarks of rohm, its affiliated companies or third parties.
datasheet datasheet notice ? we rev.001 ? 2015 rohm co., ltd. all rights reserved. general precaution 1. before you use our pro ducts, you are requested to care fully read this document and fully understand its contents. rohm shall n ot be in an y way responsible or liabl e for fa ilure, malfunction or acci dent arising from the use of a ny rohms products against warning, caution or note contained in this document. 2. all information contained in this docume nt is current as of the issuing date and subj ec t to change without any prior notice. before purchasing or using rohms products, please confirm the la test information with a rohm sale s representative. 3. the information contained in this doc ument is provi ded on an as is basis and rohm does not warrant that all information contained in this document is accurate an d/or error-free. rohm shall not be in an y way responsible or liable for an y damages, expenses or losses incurred b y you or third parties resulting from inaccur acy or errors of or concerning such information.
datasheet part number BD81010MUV package vqfn032v5050 unit quantity 2500 minimum package quantity 2500 packing type taping constitution materials list inquiry rohs yes BD81010MUV - web page distribution inventory

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